Cloud computing is ushering to a new era where security is no more a matter of firewalls and passwords for protecting and managing access to physical office networks. It is in the nature of cloud services to be accessed anytime and from anywhere thanks to chip-based devices we need to trust. But the need to shift from a simple IT security approach to a more complex “identity-proof“ security (strong authentication) model raises questions in terms of security, privacy and interoperability:
Are low security, critical privacy concerns and restricted interoperability featuring close "chip-to-cloud" ecosystems and big brand logic?
On the contrary, are high security and privacy protection, and large interoperability the distinctive attributes of the open chip-to-cloud ecosystems and coopetitive industrial initiatives?
How will they both coexist in the future?

Led by Jean-Paul Thomasson, e-Smart and Smart Mobility Program Committee Chair

• Part I: Research and industry leaders will address the various technological dimensions of the “cloud-to-chip” model and will draw future perspectives in their respective domains.
- Holger Lenz, Director Business Development, Cinterion, Germany
- Marc Muller, Head of Common Technologies, Gemalto, France
- Travis Spencer, Senior Technical Architect, Ping Identity, USA

• Part II: Panel debate on the different industrial approaches of the cloud-to-chip model: brand-based, ?coopetitive? or a new approach to be defined?
The panel will include:
- Yvon Avenel, Publisher of SmartCardsTrends, France
- Holger Lenz, Director Business Development, Cinterion, Germany
- Marc Muller, Head of Common Technologies, Gemalto, France
- Travis Spencer, Senior Technical Architect, Ping Identity, USA
- Jörg Suchy, Group Leader, Strategic Business Development, Smart Card and NFC Products, Samsung Semiconductor Europe, Germany